Yttrium Oxide (Y₂O₃) – Supplier & Manufacturer in USA

Yttrium Oxide, Y₂O₃

Yttrium oxide (Y2O3) sputtering targets are dense, high-purity ceramic sources used to deposit yttria thin films by RF and RF-reactive magnetron sputtering. Infinita Materials manufactures Y2O3 targets from 99.9% to 99.999% purity in planar round, rectangular, and rotary/cylindrical geometries, indium- or elastomer-bonded to copper backing plates, for semiconductor, optical coating, and dielectric thin-film applications.

Purity (%) :	>99.9
Dimensions :	Dia. 1”, Thick. 0.125” Dia. 2”, Thick. 0.25”

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Introduction to Yttrium Oxide

Yttrium oxide sputtering targets are fabricated from high-purity Y2O3 powder, pressed and sintered into dense ceramic discs, plates, or cylinders suitable for physical vapour deposition. Because Y2O3 is an electrical insulator, targets are generally sputtered using RF or RF-reactive power rather than standard DC. They are typically bonded to a copper backing plate to improve thermal conductivity and withstand the material’s low intrinsic thermal conductivity and brittleness.

Sputtered Y2O3 films retain the bulk material’s wide bandgap, broad UV-to-mid-IR transparency, high dielectric strength, and strong chemical stability, which is why yttria targets are specified for gate dielectric layers, optical and protective coatings, ferroelectric device stacks, and buffer layers beneath other functional oxide films. Infinita Materials fabricates targets in standard catalogue sizes or fully custom dimensions, with purity, density, and bonding matched to the deposition system and required film performance.

FAQs

Question: What purity levels are available for yttrium oxide sputtering targets?

Answer: Infinita Materials supplies Y2O3 targets from 99.9% (3N) standard grade up to 99.999% (5N) high-purity grade, with certificates of analysis confirming trace-element content for each target.

Question: Should yttrium oxide targets be bonded to a backing plate?

Answer: Bonding is recommended for most production tools because Y2O3 has low intrinsic thermal conductivity and is brittle. Indium bonding and elastomer bonding to copper backing plates are both available; unbonded targets are also offered for compatible systems.

Question: Can Y2O3 targets be sputtered with standard DC power?

Answer: No. Yttrium oxide is an electrical insulator, so targets are sputtered using RF or RF-reactive magnetron power rather than conventional DC sputtering.

Question: What target sizes and shapes are available?

Answer: Standard planar round discs are offered from 1″ to 4″ diameter, with large-format planar, block, and rotary/cylindrical targets available up to production-scale dimensions. Step and custom-profile targets can be machined to fit specific magnetron configurations.

Question: What order quantities and lead times are available?

Answer: Standard catalog sizes are typically available from single R&D-scale targets up to production volumes; custom sizes, bonding, and high-purity grades generally require longer production lead times.

Introduction to Yttrium Oxide

Property	Value	Significance
Purity	99.9% – 99.999%	Controls trace-metal content and film contamination levels
Theoretical Density	5.01 g/cm³	Higher relative density reduces arcing, particulates, and target cracking
Melting Point	~2,410°C	Supports stable sputtering without target overheating
Z-Ratio	1.00	Reference value for thickness-monitor calibration during deposition
Sputter Method	RF, RF-reactive (magnetron)	Required because Y2O3 is electrically insulating
Max Power Density	~20 W/in² (unbonded); lower when bonded	Sets practical deposition rate and thermal budget
Bandgap (film)	~5.5 – 6.0 eV	Wide-bandgap insulator suited to gate dielectric and UV-transparent films
Refractive Index (film)	~1.9 (visible range)	High index benefits AR, IR, and protective optical coatings
Thermal Conductivity	Low; brittle ceramic	Drives the recommendation to bond targets to a backing plate
Deposition Behavior	Can lose oxygen during sputtering	Films remain smooth and clear when process oxygen is controlled

Property

Value

Significance

Purity

99.9% – 99.999%

Controls trace-metal content and film contamination levels

Theoretical Density

5.01 g/cm³

Higher relative density reduces arcing, particulates, and target cracking

Melting Point

~2,410°C

Supports stable sputtering without target overheating

Z-Ratio

1.00

Reference value for thickness-monitor calibration during deposition

Sputter Method

RF, RF-reactive (magnetron)

Required because Y2O3 is electrically insulating

Max Power Density

~20 W/in² (unbonded); lower when bonded

Sets practical deposition rate and thermal budget

Bandgap (film)

~5.5 – 6.0 eV

Wide-bandgap insulator suited to gate dielectric and UV-transparent films

Refractive Index (film)

~1.9 (visible range)

High index benefits AR, IR, and protective optical coatings

Thermal Conductivity

Low; brittle ceramic

Drives the recommendation to bond targets to a backing plate

Deposition Behavior

Can lose oxygen during sputtering

Films remain smooth and clear when process oxygen is controlled

Grade / Form	Typical Purity	Key Features / Uses
Standard Planar Round	99.9% – 99.99%	1″–4″ diameter catalogue discs; 0.125″ or 0.250″ thick; general PVD coating
Large-Format Planar / Block	99.9% – 99.99%	Up to ~14″ dia. or 32″ × 12″ rectangular; production-line in-line sputtering
High-Purity Grade	99.999% (5N)	Semiconductor gate-dielectric and low-defect optical films
Rotary / Cylindrical Targets	99.9% – 99.99%	High material utilisation for large-area, high-throughput coating lines
Step & Custom-Profile Targets	99.9% – 99.99%	Engineered erosion profile for specific magnetron configurations
Bonded Assemblies	Indium- or elastomer-bonded to Cu backing plate	Improved thermal dissipation; required for most production tools

Grade / Form

Typical Purity

Key Features / Uses

Standard Planar Round

99.9% – 99.99%

1″–4″ diameter catalogue discs; 0.125″ or 0.250″ thick; general PVD coating

Large-Format Planar / Block

99.9% – 99.99%

Up to ~14″ dia. or 32″ × 12″ rectangular; production-line in-line sputtering

High-Purity Grade

99.999% (5N)

Semiconductor gate-dielectric and low-defect optical films

Rotary / Cylindrical Targets

99.9% – 99.99%

High material utilisation for large-area, high-throughput coating lines

Step & Custom-Profile Targets

99.9% – 99.99%

Engineered erosion profile for specific magnetron configurations

Bonded Assemblies

Indium- or elastomer-bonded to Cu backing plate

Improved thermal dissipation; required for most production tools

Industry	Application	Function
Semiconductor Manufacturing	High-k gate dielectric and passivation layers on CMOS devices	Wide bandgap and high dielectric strength improve device performance
Optics & Photonics	AR coatings, IR-transparent films, protective optical coatings	High refractive index with broad UV–IR transmission
Ferroelectric & Memory Devices	Buffer and interface layers in ferroelectric device stacks	Chemical compatibility and stable dielectric interface
Display & Lighting	Sputtered phosphor and functional oxide layers	Stable, uniform films for display and lighting components
Protective Coatings	Corrosion- and wear-resistant thin films on metal and ceramic substrates	Chemical inertness and thermal stability extend component life
Buffer & Template Layers	Underlayers for epitaxial or functional oxide film growth	Lattice and chemical compatibility with other oxide films

Industry

Application

Function

Semiconductor Manufacturing

High-k gate dielectric and passivation layers on CMOS devices

Wide bandgap and high dielectric strength improve device performance

Optics & Photonics

AR coatings, IR-transparent films, protective optical coatings

High refractive index with broad UV–IR transmission

Ferroelectric & Memory Devices

Buffer and interface layers in ferroelectric device stacks

Chemical compatibility and stable dielectric interface