Nickel Ferrite, NiFe2O4

Nickel ferrite (NiFe2O4) sputtering targets from Infinita Materials supply a dense, high-purity source of the archetypal soft ferrimagnetic spinel oxide used to deposit magnetic thin films for RF, microwave, and spintronic devices. Unlike garnet-based or hard ferrite systems, NiFe2O4 combines a cubic inverse-spinel structure, moderate saturation magnetisation, and high electrical resistivity in a single oxide, making it a workhorse material for magneto-electronic thin-film stacks.

Purity (%) :>99.9
Dimensions :Dia. 1”, Thick. 0.125” Dia. 2”, Thick. 0.25”
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    Introduction to Nickel Ferrite

    NiFe₂O₄ crystallises in the cubic inverse spinel structure (Fd-3m), with Ni²⁺ occupying octahedral sites and Fe³⁺ distributed between tetrahedral and octahedral sites. Antiparallel coupling of these sublattices produces ferrimagnetism, with a Curie temperature around 585 °C and high electrical resistivity compared with metallic magnetic materials. These properties make nickel ferrite attractive for high-frequency magnetic applications. RF or pulsed-DC sputtering from ceramic targets enables controlled Ni: Fe stoichiometry and uniform thin-film deposition on silicon, sapphire, MgO, and other substrates. Sputtered NiFe₂O₄ films are used in microwave and millimetre-wave components, spin-filter and tunnel-barrier structures, magneto-optic devices, magnetic sensors, and gas-sensing applications requiring controlled thickness and interfaces.

    FAQs

    Question: What is Nickel Ferrite (NiFe₂O₄) used for in sputtering?

    Answer: Nickel Ferrite is commonly used as a sputtering target for thin film deposition in applications such as magnetic materials, sensors, and electronic devices.

    Question: What are the benefits of using NiFe₂O₄ as a sputtering target?

    Answer: NiFe₂O₄ provides excellent magnetic properties and high electrical resistivity, making it ideal for producing films with stable, high-quality properties for various electronics and spintronic applications.

    Question: What is the typical deposition environment for NiFe₂O₄ targets?

    Answer: NiFe₂O₄ targets are typically used in a vacuum-sputtering environment with argon or other inert gases, depending on the desired film properties.

    Question: What are the challenges when using NiFe₂O₄ as a sputtering target?

    Answer: One challenge is controlling the stoichiometry during deposition, as deviations from the target's composition can affect the magnetic and electrical properties of the resulting films.

    Question: How does NiFe₂O₄ compare to other materials used in sputtering?

    Answer: Compared to other magnetic materials, NiFe₂O₄ offers a good balance of low electrical conductivity and high permeability, making it suitable for specific applications requiring both magnetic and resistive properties.