Lanthanum Nickel Oxide, LaNiO3

Lanthanum nickel oxide (LaNiO3) is supplied by Infinita Materials as a high-density ceramic sputtering target for depositing conductive perovskite oxide thin films. Unlike most rare-earth transition-metal oxides, LaNiO3 is a correlated metal in its bulk and thin-film form, making it the standard choice for epitaxial bottom electrodes beneath ferroelectric and multiferroic oxide layers. Targets are produced as sintered discs at 99.9% to 99.99% purity, with custom sizes, bonding, and rotary configurations available for research and production-scale physical vapour deposition.

Purity (%) :>99.9
Dimensions :Dia. 1”, Thick. 0.125” Dia. 2”, Thick. 0.25”
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Introduction to Lanthanum Nickel Oxide

Lanthanum Nickel Oxide LaNiO3 crystallises in a rhombohedrally distorted perovskite structure (R-3c), consisting of corner-sharing NiO6 octahedra with La3+ occupying the A-site and Ni3+ at the B-site. Unlike other rare-earth nickelates, LaNiO3 is metallic and exhibits weak paramagnetism due to itinerant electronic behaviour. Its oxygen stoichiometry is sensitive to reducing conditions, which can cause decomposition. As a sputtering target, dense LaNiO3 ceramic enables reproducible deposition of conductive, epitaxial oxide films on substrates such as SrTiO3 and LaAlO3. Sputtered LaNiO3 films are widely used as conductive bottom electrodes, templates, and buffer layers in ferroelectric, oxide-electronic, fuel-cell, sensing, and emerging memory applications.

FAQs

Question: What are the main applications of LaNiO3 sputtering targets?

Answer: LaNiO3 targets are primarily used for depositing thin films in electronics, sensors, and fuel cells, particularly for conducting oxide layers and electrode materials.

Question: Why choose LaNiO3 as a sputtering target?

Answer: LaNiO3 offers high electrical conductivity, thermal stability, and chemical stability, making it suitable for applications requiring high-performance conductive films.

Question: What deposition techniques are used for LaNiO3?

Answer: LaNiO3 is typically deposited using sputtering techniques, including RF sputtering, which allows for precise film thickness and uniformity control.

Question: What are the challenges with LaNiO3 sputtering?

Answer: The main challenges include maintaining a stable deposition rate, minimizing oxidation during sputtering, and ensuring target uniformity and film adhesion.