Lead Calcium Titanate, Pb_0.7Ca_0.3TiO₃

Purity (%) :	>99.9
Dimensions :	Dia. 1”, Thick. 0.125” Dia. 2”, Thick. 0.25”

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Description
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Catalogue Code	IN-CaPbTi-01 IN-CaPbTi-02
CAS No.	12049-50-2
Chemical Formula	Pb_0.7Ca_0.3TiO₃
Compound Name	Lead Calcium Titanate
Purity (%)	>99.9
Dimensions	Dia. 1”, Thick. 0.125” Dia. 2”, Thick. 0.25”

Introduction

The lead calcium titanate sputtering target comprises lead, calcium, titanium, and oxygen. High-purity lead calcium titanate sputter targets play a considerable role in deposition processes to ensure high-quality deposited film. The most common methods for synthesizing (Pb_0.7Ca_0.3TiO₃) include solid-state reactions and sol-gel processes to be of high purity and with desired structural characteristics.

Properties

The table below contains all the critical properties of Lead Calcium Titanate (Pb_0.7Ca_0.3TiO₃):

Properties	Description
Appearance and Shape	Solid, Thin film, Disc
Molar mass	~ 343.1432 g/mol
Magnetic Type	Non-magnetic
Thermal conductivity	~ 3–5 W/m·K

Application

Here are some applications of Lead Calcium Titanate (Pb_0.7Ca_0.3TiO₃):

Non-Volatile Memory (FeRAM): PCT films are used in non-volatile memory devices due to their ability to switch polarization states, making them ideal for ferroelectric random-access memory (FeRAM).
Optoelectronic Applications: Thin films of PCT are employed in optical modulators and photonic devices for their electro-optic properties.
Ultrasonic Transducers: They are used in ultrasonic devices, like medical diagnostic equipment and underwater sonar, because they very sensitively respond to mechanical vibrations.

FAQs

Question: What is the use of Pb₀.₇Ca₀.₃TiO₃ in sputtering?

Answer: It is commonly used for depositing thin films in electronic and optical devices, including piezoelectric sensors, ferroelectric capacitors, and memory applications.

Question: What are the critical properties of Pb₀.₇Ca₀.₃TiO₃ thin films?

Answer: These films exhibit excellent ferroelectric, piezoelectric, and dielectric properties, making them suitable for advanced functional devices.

Question: What are common challenges during sputtering with Pb₀.₇Ca₀.₃TiO₃?

Answer: Target cracking due to thermal stress and stoichiometric control in thin films are common challenges. Using a compatible backing plate and fine-tuning deposition conditions can mitigate these issues.